Ideal Vacuum Circular Magnetron Sputtering Targets, VANADIUM - V Sputtering Target, 3'' Diameter x 0.25" Thick, 99.9 Percent Purity

This product is a circular magnetron VANADIUM - V sputtering target, with a 3'' diameter x 0.25" thickness. It is 99.9% pure.

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VANADIUM - V

Key Properties for PVD Sputtering Targets Appearance: Silvery-gray, ductile transition metal Density: ~6.11 g/cm³ (low compared to many transition metals) Crystal Structure: Body-centered cubic (BCC) Melting Point: 1910 °C (high, good thermal stability) Boiling Point: ~3407 °C Thermal Conductivity: ~30.7 W/m·K (moderate) Electrical Resistivity: ~19.7 µO·cm (conductive, suitable for DC sputtering) Corrosion Resistance: Good, forms a stable oxide layer (V2O5) in air Sputtering Yield: Moderate, higher in metallic mode; reactive sputtering produces compounds such as vanadium oxide (VO2, V2O5) and vanadium nitride (VN) Reactivity: Readily reacts with oxygen and nitrogen, enabling functional coatings Special Properties: VO2 exhibits a thermochromic phase transition (optical switching), VN has high hardness and wear resistance Applications: Optical coatings, thermochromic smart windows, hard coatings, catalysts, and functional layers in electronics

Vanadium Properties and Applications:

Vanadium is valued in PVD sputtering for its ability to form both pure metallic and functional compound thin films. In metallic form, vanadium coatings provide good adhesion, moderate hardness, and corrosion resistance. Its reactivity with oxygen and nitrogen allows for the deposition of vanadium oxide (VO2, V2O5) and vanadium nitride (VN) films with distinct functional properties.

Vanadium oxides are widely used in thermochromic coatings (especially VO2) for smart windows, enabling infrared light control through a temperature-driven phase transition. V2O5 films are applied in catalysis, electrochromic devices, and battery electrodes. Vanadium nitride offers high hardness, wear resistance, and electrical conductivity, making it suitable for protective coatings in tooling and electronics.

In PVD processes, vanadium targets can be sputtered in DC mode for metallic films or with reactive sputtering in oxygen/nitrogen atmospheres to produce oxides and nitrides. Deposition rates are moderate, and process control is important to achieve the desired stoichiometry and phase. This versatility makes vanadium a key material for optical, protective, catalytic, and electronic thin-film applications.

Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.