Ideal Vacuum Circular Magnetron Sputtering Targets, CALCIUM FLUORIDE - CaF₂ Sputtering Target, 3'' Diameter x 0.25" Thick, 99.9 Percent Purity, Metallic Bonded to a 0.125" OFHC Copper Backing Plate

This product is a circular magnetron CaF₂ sputtering target, with a 3'' diameter x 0.25" thickness. It is 99.9% pure, and is metallically bonded to a 0.125" OFHC (Oxygen-Free High Conductivity) copper backing plate

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Calcium Fluoride (CaF₂)
Properties
Appearance: Transparent, colorless crystalline solid (fluorite structure)

Density: ~3.18 g/cm³

Crystal Structure: Cubic (fluorite type)

Melting Point: ~1418 °C

Boiling Point: ~2533 °C

Thermal Conductivity: ~9.7 W/m·K (moderate)

Electrical Properties: Excellent insulator (resistivity >10¹² O·cm)

Optical Properties: Wide bandgap (~12.1 eV), high transmission from deep UV (~150 nm) to mid-IR (~8–9 µm)

Chemical Stability: Chemically stable, moisture-resistant, and non-hygroscopic; insoluble in water

Sputtering Behavior: Brittle insulating ceramic — requires RF magnetron sputtering; low sputter yield compared to metals

Usage in Thin Films

Calcium fluoride is widely deposited via RF magnetron sputtering in PVD systems for optical applications due to its broad transparency range and low refractive index (~1.43). It is often used in combination with high-index materials in multilayer stacks.

Key Applications:

Optical Coatings: Anti-reflective layers, beam splitters, and laser optics (especially UV and IR systems).

UV Optics: Windows, lenses, and coatings for excimer lasers and lithography equipment.

Infrared Optics: Coatings for IR sensors, thermal imaging systems, and spectroscopy instruments.

Protective Coatings: Durable, moisture-resistant layers in harsh optical environments.

Multilayer Designs: Paired with high-index materials (e.g., HfO2, Ta2O5) in precision interference filters.

Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.