Ideal Vacuum Circular Magnetron Sputtering Targets, TITANIUM MONOXIDE - TiO Sputtering Target, 3'' Diameter x 0.25" Thick, 99.99 Percent Purity - White, Metallic Bonded to a 0.125" OFHC Copper Backing Plate

This product is a circular magnetron TiO sputtering target (white), with a 3'' diameter x 0.25" thickness. It is 99.99% pure, and is metallically bonded to a 0.125" OFHC (Oxygen-Free High Conductivity) copper backing plate

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Titanium monoxide (TiO)

Properties

Appearance: Black to dark brown, ceramic-like material

Density: ~4.9–5.0 g/cm³

Crystal Structure: Cubic (NaCl-type)

Melting Point: ~1750–2000 °C (varies with stoichiometry)

Electrical Properties: Metallic-like conductivity; resistivity typically ~30–100 µO·cm (higher than pure Ti but much lower than TiO2)

Thermal Conductivity: Moderate (~7–12 W/m·K)

Chemical Stability: Stable in vacuum and inert atmospheres; can oxidize to TiO2 in air at elevated temperatures

Sputtering Behavior: Conductive enough for DC or pulsed DC sputtering; brittle, so thermal shock can cause cracking if power is ramped too quickly

Usage in Thin Films
Titanium monoxide is sputtered in PVD processes to produce films with a mix of metallic conductivity and ceramic durability, making it suitable for both functional and protective coatings.

Key Applications:
Electrical Contacts & Interconnects: Conductive ceramic layers with good adhesion to metals and ceramics

Barrier Layers: Diffusion barriers in microelectronics due to chemical stability and moderate conductivity

Optical Coatings: Absorbing layers in optical stacks, thermal control coatings, and decorative films

Hard Coatings: Wear-resistant layers for tools, dies, and mechanical parts

Transition Layers: Adhesion-promoting interlayers between metals and insulating oxides in multilayer coatings

Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.